Invited Paper

Prof. HE Yunbo (Click for Biography)
Guangdong University of Technologies
Invited Paper Presentation
Development of High Performance Bonding Machines with Improved Motion Control and Intelligent Fine Tuning Algorithm

Abstract (Expand)

Dr. CHE Faxing (Click for Biography)
Institute of Microelectronics, A*STAR
Invited Paper Presentation
Modeling and Design Solutions to Overcome Warpage Challenge for Fan-Out Wafer Level Packaging (FO-WLP) Technology

Abstract (Expand)

Dr. Yoichiro Kurita (Click for Biography)
Toshiba Corporation
Invited Paper Presentation
A Novel III-V/Si Chip-on-Wafer Direct Transfer Bonding Technology

Abstract (Expand)

Dr. YOON Seung Wook (Click for Biography)
STATS ChipPAC Ltd.
Invited Paper Presentation
Advanced Wafer Level Technology: Enabling Innovations in Mobile, IoT and Wearable Electronics

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Prof. Gan Chee Lip (Click for Biography)
Nanyang Technological University. Temasek Laboraties@NTU
Invited Paper Presentation
Application of Copper Nanoparticles as Die Attachment for High Power LED

Abstract (Expand)

Dr. Gao Shan (Click for Biography)
GlobalFoundries Pte Ltd
Invited Paper Presentation
TSV Integration with 20nm CMOS Technology for 3D-IC Enablement

Abstract (Expand)

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