Professional Development Courses

PDC 1: Fanout Wafer Level Packaging (FO-WLP) – Innovative packaging solutions with scalability
2nd December 2015, 8:30am - 12.20pm
Course Leader:
Yoon Seung Wook, PhD (Click for Biography)
Affiliation:
STATS ChipPAC, Singapore

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PDC 2: Automotive Packaging & Its Reliability Requirements
2nd December 2015, 8:30am - 12.20pm
Course Leader:
Werner Kanert, PhD (Click for Biography)
Affiliation:
Infineon Technologies, Germany

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PDC 3: 3D IC integration and 3D IC Packaging
2nd December 2015, 8:30am - 12.20pm
Course Leader:
John H Lau, PhD (Click for Biography)
Affiliation:
ASM Pacific Technology, Hong Kong

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PDC 4: Failure Analysis of 2.5D/3D IC packages: Fundamental principles, Applications and Challenges
2nd December 2015, 1:10pm - 5.00pm
Course Leader:
Yong-Fen Hsieh, PhD (Click for Biography)
Affiliation:
MA-tek, Taiwan

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PDC 5: Chip Package Interaction (CPI) for Leading Edge (Sub-20nm) Silicon Technology
2nd December 2015, 1:10pm - 5.00pm
Course Leader:
Shan Gao, PhD (Click for Biography)
Affiliation:
GLOBALFOUNDRIES, Singapore

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PDC 6: Adhesion Science & Practice with an Emphasis on Temporary Bonding of Electronics
2nd December 2015, 1:10pm - 5.00pm
Course Leader:
Jared Pettit, Alex Brewer, Alman Law, and John Moore (Click for Biography)
Affiliation:
DAETEC, USA

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