- Dr Curry Chen, ASE Global, Title: "Development of multi-chip integration non-molded 2.5D IC Packaging Technology"
- Prof Jeffrey C. , Auburn University
- Mr. Kikuchi, Fujitsu
- Dr Gokul Kumar, Western Digital
- Mr. C.S Premachandran, Global Foundries
- Prof Yogendra Joshi, Georgia Institute of Technology, Title:"Cooling of high power microelectronic components using flow boiling"
- Mr. Murayama, Shinko Electric Industries, Title: "Effects of trace element on electro-migration of flip chip interconnect between Cu pillar and Sn-Bi alloy system"
- Dr Szu Huat Goh, Global Foundries, Title:"Evolution of Fault Isolation Techniques for Product Failure Analysis"
- Dr Sia Choon Beng, Formfactor, Title:" Highly Accurate, Efficient and Reliable Silicon Photonics Wafer-Level Test and Characterization"
- Dr Takenori Fujiwara, Toray Industries, Inc, Title: " Development of Novel Polymer Materials for Advance Packaging"
- Dr Murali, Heraeus Singapore, Title: " Micro-Interconnects: Signal Integrity in 5G applications."