Technical Committee 2018

Advanced Packaging


Role Name Organisation
Chair Navas KHAN Infineon Technologies
Co-chair Rainer Dudek Fraunhofer ENAS
Member V.P GANESH Infineon Technologies
Member Aditya Kumar GLOBALFOUNDRIES
Member Jean-Charles SOURIAU LETI
Member Vempati SRINIVAS Institute of Microelectronics
Member C.S. Foong NXP Semiconductor
Member Bok Eng CHEAH Intel Microelectronics
Member KIM Hyoung Joon Qualcomm
Member Jatinder Kumar Semtech
Member  Vasarla Nagendra Sekhar Institute of Microelectronics
New member  Dr.-Ing. Karsten Meier Technische Universität Dresden ;  
TSV/Wafer Level Packaging


Role Name Organisation
Chair Dr. YOON Seung Wook Statschippac Pte LTD
Co-Chair Dr. Mark Huang Suzhou SPEED Semiconductor Technology Pte Ltd), China
Member Mr. Ranjan Rajoo Global Foundries, Singapore
Member Dr. CHEN Kuoming UMC, Taiwan
Member Dr. GAURAV Sharma Global Foundries, US
Member Mr. YANG Seung Taek SK Hynix Semiconductor, Korea
Member Dr. LEE Jaesik nVidia, US
Member Dr. Mingliang HUANG Dalian University of Technology, China
Member Dr. JUNG Boo Yang Global Foundries, Singapore
Member Mr. Thorsten Meyer Infineon AG, Germany
Member Mr. Kroehnert Steffen Nanium
Member Mr. Santosh KUMAR Yole Development
Interconnection Technologies


Role Name Organisation
Chair David HUTT Loughborough University
Co-chair Liming SHEN Kulicke & Soffa, Singapore
Member Horst CLAUBERG KnS
Member Wei FAN Singapore Institute of Manufacturing Technology
Member Hong Meng HO Infineon
Member James HOW Singapore
Member Yew Cheong MUI  Advanced Micro Devices, Singapore
Member Nga Phuong PHAM IMEC, Belgium
Member Daquan YU Chinese Academy of Science, China
Member Jack XIONG Qorvo, Singapore
New member  Tanemasa ASANO  Kyushu University
New member  Kyung W. Paik KAIST




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