EPTC

The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.

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Excited to introduce our distinguished keynote speakers for the 26th IEEE EPTC 2024! Leading voices from industry and academia will address groundbreaking topics:

Dr. Vic Lin Jing-Cheng (EVP, Samsung): Unleashing AI power: The hybrid Copper Bonding Technology for 3D System integration, HBM and CPO.
Glenn G. Daves (SVP, NXP): Packaging at the emerging edge.
Dr. Yu-Po Wang (VP, Siliconware Precision): Breaking boundaries of IC packaging through Innovative Integration Technology.
Tim Olson (CEO, Deca): Tectonic Forces shaping the future of the Semiconductor Industry.
Devan Iyer (Chief Strategist, IPC): Advanced Packaging-Customization Trends and Standardization Opportunities.
Subramanian S. lyer (Distinguished Professor and Charles P. Reames Endowed Chair, UCLA): Strategic Directions for Electronics Packaging

General Information

Conference Registration Schedule

Author Registration: Sept 1, 2024

Early Bird Registration: Oct 31, 2024

Standard Registration: Dec 5, 2024

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