Keynote Speakers

·         Dr. Wai Kooi Wong, Vice President, Quality And Reliability, Xilinx, “Extending Moore’s Law with Advanced Packages”

 ·         Dr. Rajendra Pendse, Vice President, R&D, Qualcomm, “Evolution of Packaging for Mobile Platforms – Past, Present and Future”

Panel Session

       Challenge of 5G-mm Wave Packaging & Opportunity

       Moderator - Dr. Rick Sturdivant, Department of Engineering and Computer Science, Azusa Pacific University, USA.

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