Header
Twitter Linkedin
 


Registration System is Open.
Act now & secure a place at the 16th Electronics Packaging Technology Conference!.
Download EPTC 2014 presentation template. Either authors can upload online or bring to the conference.
 

Greeting from EPTC

The 16th Electronics Packaging Technology Conference (EPTC 2014) is an International event organized by the IEEE Reliability/ CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

EPTC 2014 is a three-day event, featuring 2 keynote speeches, 5 invited papers and a panel session by pioneers from key regions in the world, 6 short courses by international experts, ~150 technical and poster presentations by researchers, an industrial technology exhibition, and last but not least our exciting and fun social networking activities.

Since its inauguration in 1997, EPTC has evolved over the years into a highly reputed electronics packaging conference in Asia.

The conference provides a good coverage of technological developments in all areas of electronics packaging from design to manufacturing and operation. It is a distinguished forum that brings together researchers, engineers and experts from all over the world to engage actively in technical interactions.

Looking forward to see you in EPTC 2014.

Alfred YEO
16th EPTC 2014 General Chair

-->


“The larger the island of knowledge, the longer the shore line of wonder.”

                                                                                                              — Ralph W. Sockman



2012 Best Paper Award Winners


2012 Best Academic Paper Winner

   2012 Best Poster Paper Winner

 


EPTC 2012 Best Industry, Academic and Poster Paper Awards

Best Industry Paper(Cash award SGD1500):
Forced-Resonance Test Technique for Multiple Wirebonds in Electronic Packages
Sukeshwar KANNAN, Bruce KIM, *Friedrich TAENZLER.
The University of Alabama,*Texas Instruments Incorporated.


Best Academic Paper(Cash award SGD1500):
Pattern Density Effect on Interfacial Bonding Characteristics of Cu-Cu Direct Bonds for 3D IC Packages
J.M. PARK, J.B. KIM, *J.W.KIM, **Y.R KIM, ***S.E KIM, Y.B PARK.
Andong National University, *Nanyang Technological University,
**MSP Center, Seoul National University of Science Technology.


Best Poster Paper(Cash award SGD1000):
COMPRESSING Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni
Youkai CHEN, Fulong ZHU, Hengyou LIAO, Wei ZHANG, Sheng LIU
Huazhong University of Science & Technology.




Website Last Updated: 16-08-2014

 
 
 
Copyright © 2014 EPTC 2014. All rights reserved. Powered by Research Publishing Services (RPS)