Panel Session


    Challenge of 5G-mm Wave Packaging & Opportunity

     Dr. Rick Sturdivant, Department of Engineering and Computer Science, Azusa Pacific University, USA.

Dr. Rick Sturdivant is a recognized expert in the field of electronic packaging, transmit/receive modules, and phased arrays. He is coeditor of RF and Microwave Microelectronics Packaging II (Springer Publishing, 2017), coauthor of Transmit Receive Modules for Radar and Communication Systems (Artech House, 2015), coauthor of Hands On Guide To Heat Transfer For Microwave and Millimeter-wave Electronics ( eBook, 2015), and author of Microwave and Millimeter-wave Electronic Packaging (Artech House, 2013). He has also contributed several book chapters, numerous journal papers and conference papers. He holds seven U.S. patents. From 1989 to 2000 he engineered transmit receive modules for Hughes/Raytheon where he received the engineering excellence award for developing the world’s first tile array module. Since the year 2000, he has started several successful technology companies providing solutions for wireless, microwave, millimeter-wave, and high-speed products. He is an Assistant Professor at Azusa Pacific University Founder and Chief Technology Officer of MPT, Inc. He earned the Ph.D. degree from Colorado State University, M.A. degree from Biola University, M.S.E.E. degree from the University of California at Los Angeles, B.S.E.E. degree from the California State University at Long Beach, and the B.A. degree from Vanguard University. For more up to date information, visit his website at


Brochure for Prof Rick's new book: Sturdivant flyer_US.pdf


Dr. Rajendra Pendse, Senior director, R&D, Qualcomm, “Evolution of Packaging for Mobile Platforms – Past, Present and Future”

Raj Pendse

Bio: Dr. Raj Pendse leads Packaging Strategy at Qualcomm, covering core Packaging technology for Application Processors, Modems and RF/Analog devices and use cases in Mobile and adjacent markets like Automotive and Servers.

Prior to Qualcomm, Raj held leadership roles at STATSChipPAC (now JCET), Hewlett-Packard Labs and National Semiconductor, where his work spanned the areas of Packaging for high-end microprocessors, ASIC’s, GPU’s and low-cost packaging solutions for Consumer hardware. His most recent focus has been on new Packaging for 5G which includes novel approaches like SoC partitioning, new Memory integration schemes and mm wave RF & antenna integration.  

Raj completed his BS in Materials Science from IIT Bombay with Top in Class honors and his Doctorate in Materials Science from UC Berkeley. 

Santosh Kumar , Senior Technology and Market Analyst , Yole Developpement

Santosh Kumar is currently working as Senior Technology & Market Research Analyst at Yole Développement. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging. He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

 Ranauld Perez, Marketing director, Johnstech International

Current Responsibility:

Director of Marketing, Sales and Business Development – Johnstech International (Minneapolis, MN)

Past Affiliations:
Business Director, Maxim Integrated, Mobile Power
Marketing Director, R2 Semiconductor, RF Power
Senior Product Marketing Manager at National Semiconductor and Skyworks Solutions
Product Engineering Manager, International Rectifier


Eldon Staggs , ANSYS Inc, USA