The 23rd Electronics Packaging Technology Conference (EPTC) is an International event organized by the IEEE RS/EPS/EDS Singapore Chapter and sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia-Pacific region and is well attended by experts in all aspects of packaging technology from all over the world. It is a major forum for the exchange of knowledge and experience in electronics packaging, and provides opportunities to network and meet with leading international experts.


EPTC is the flagship conference of IEEE EPS in Region 10. As such, it will feature some of the initiatives of EPS such as the presentation of best papers from ECTC and meetings of EPS Region 10 Chapter Chairs and EPS Board of Governors. Its program includes keynotes from high-level executives and experts in the industry, a panel session on a hot topic of the day, specially invited presentations by experts in their fields as well as professional development courses.  A Workshop on the Heterogeneous Integration Roadmap will also be held. The technical sessions cover the whole range of electronic packaging including the following categories:

Advanced Packaging

TSV/Wafer Level Packaging 

Interconnection Technologies

Emerging Technologies

Materials and Processing

Assembly and Manufacturing Technology

Advanced Materials and Process Manufacturing Technology

Electrical Simulation & Characterization

Mechanical Simulation & Characterization

Thermal Characterization & Cooling Solutions

Quality, Reliability & Failure Analysis