EPTC Technical Committee  is pleased to announce the "Best Paper Awards" for the 21st Electronics Packaging Technology Conference (2019);  Each awardee receives  a Certificate and Cash.  Congratulations to all the recipients! 

We will also like to take this opportunity to thank ASE Group, for their sponsorship of the best student paper. Their continuous support helps tremendously in motivating a new generation of engineers.

Best Academic paper

Paper ID 313. Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading

Awarded to Karsten Meier, David Leslie, Abhijit Dasgupta, M. Roellig, Karlheinz Bock.  Technische Universität Dresden, Institute of Electronic Packaging Technology, D-01062 Dresden, Germany

Best Industrial paper          

Paper ID 237. Stress and strain level evolution and correlation to void migration in solder bumps after various thermo-mechanical post treatments 

Awarded to Keith Newman, Tae-Kyu Lee, Gek Joo Tan, Siew Kim Lim. AMD, Santa Clara, CA, USA

Best Student paper (Proudly Sponsored by ASE Group)

Paper ID 276. A new substrate for realizing encapsulant layer to enhance light efficiency of light-emitting diodes

Awarded to Puzhen Xia, Xingjian Yu, Xiaobing Luo, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China

Best Interactive Paper

Paper ID 249. Behavior of Resorcinol based Phthalonitrile as High Temperature Encapsulant

Awarded to Tay Yu Shan, Eric Phua Jian Rong, Gan Chee Lip. School of Materials Science and Engineering, Nanyang Technological University, Singapore