Call For Papers

EPTC 2021  2nd Call for Papers  Download

The 23rd  Electronics PackagingTechnology Conference (EPTC 2021) is an international event organized by theIEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE ElectronicsPackaging Society (EPS). EPTC 2021 will feature keynotes, technical papers, Invited talks, Panel session. It aimsto provide a good coverage of technology developments in all areas ofelectronics packaging from design to manufacturing and operation. It is a majorforum for the exchange of knowledge and provides opportunities to network andmeet with leading international experts.  Since its inauguration in1997, EPTC has developed into a highly reputed electronics packaging conference and recognized as IEEE EPS  flagship conference in Region 10.

Youare invited to submit abstract(s) on new research and developments in thefollowing packaging categories:

Advanced Packaging:Flip-chip, 2.5D & 3D, embedded passives& actives on substrates, chiplets, system in packaging, embedded chippackaging technologies, panel-level packaging, RF, microwave & millimeter-wave,power and rugged electronics packaging. Advanced packaging solutions for 5G,IoT, cloud computing, autonomous vehicles, antennas, sensors, power transfer,EM shielding, RF to THz communications.

TSV/Wafer Level Packaging: Wafer-levelpackaging, embedded chip packaging, 2.5D/3D integration, Silicon, SiC &Glass interposer, CoWoS, FoCoS, InFo, eWLB, bumping technologies, and so forth.

InterconnectionTechnologies: Au/Ag/Cu/AlWire-bond / Wedge bond technology, Flip-chip & Cu pillar, Solderalternatives, Cu to Cu, wafer-level bonding & die attachment (Pb-free),Fan-out, panel-level, chiplets, SiP, micro-bump, high I/Othermo-compression/hybrid bonding, fine-pitch/multi-layer RDL, printableinterconnects, conductive/ nonconductive adhesives, low-temperature solder,interconnects design and technology for emerging applications.

EmergingTechnologies: Novel and unique packagingand material technologies for soft and intelligent packaging, flexible hybridelectronics, implantable biosensors and bioelectronics, packaging for extremeharsh environment, green/bio-resorbable packaging;  packaging of MEMS & NEMS,  packaging for wide bandgap devices, quantumcomputing,  packaging sensing andcommunication.

Materials and Processing: Photoresist, polymerdielectrics, solder, die-attach, underfill, substrates, lead-frames, materialsfor wafer & panel-level packaging; harsh environments; wafer bonding/debond materials; emerging electronic materials & processes; novel soldermetallurgies; molding compounds; thermal interface materials; advancedwire-bonding, conductive adhesives. PCB for advanced packaging, assemblyprocesses using newer materials. Substrates in the large/ultra-large package(SiP, SIM, MCP) integration

Assembly and ManufacturingTechnology: Embedded/hybridpackage manufacturing processes; warpage control and management in board-level assembly;thin die/package handling and assembly advancein flexible and printed electronics manufacturing Large/ultra-large package(SiP, SIM, MCP) integration and manufacturing; thermally enhanced packaging andassembly challenges. Additivemanufacturing. Panel-level manufacturing and assembly. Heterogeneousintegration and manufacturing.

Electrical Simulation &Characterization: Power plane modelling, Signalintegrity analysis by simulations and characterization, 2D/2.5D/3D packagelevel high-speed signal design, characterization and test methodologies.

Mechanical Simulation &Characterization: Thermal-mechanicalinteraction, moisture, fracture, fatigue, dynamic impact modelling andcharacterization. process modelling, etc.

Thermal Characterization& Cooling Solutions: Thermalcharacterization and simulation, component, system and product level thermalmanagement and characterization

Quality, Reliability &Failure Analysis: Silicon,component, board and system-level reliability assessment, interfacial adhesion,accelerated testing, failure characterization.

Photonics, Optoelectronicsand Displays: Designsimulationinterconnectionpackaging,integration and materials for optoelectronics and novel displays - micro/mini/nanoLED, foldable and flexible displaysaugmentedreality and virtual reality and wearable displays. Silicon and III-V photonics;optical sensors, interconnects, interposers, quantum device packaging;photonics SiP; free-space optical communications, waveguide; automotivephotonics, 3D sensing; optoelectronic fiber coupling assembly, materials andreliability; fiber optic transceivers. electro-optical integration.

Smart Manufacturing andEquipment Technology: SmartManufacturing in packaging, cycle time, data analytics, advanced metrology,machine learning, artificial intelligence, advanced equipment for assembly, packagingand handling Digital Twin and process simulation. 


Technology talk by industry and academics experts in advanced packaging was introduced in EPTC2020. it  was well appreciated by the delegates and the  committee is happy to continue the Technology talk in EPTC 2021. We are inviting industry and academic experts in packaging R&D and Manufacturing supplier industries (materials, equipment and services) on technology innovation, challenges, potential gaps, product and services road map. More details are updated on the conference website, and proposals for technology talks can be submitted at