Step Into the Future: EPTC 2023 Ignites the Spark of Technological Evolution
Dive deep into the epicenter of technological metamorphosis with EPTC 2023, the sanctuary for innovation and ground-breaking discoveries in the realm of advanced packaging. This year, we're going beyond the ordinary, piercing through the veil of innovation and exploring the uncharted territories of the future.
Are you ready to challenge the constraints of the present? Our curated assembly of thought leaders is here to catapult your understanding and invigorate your curiosity:
- "Modeling and Characterization of Single Grain Solder Micro Bumps in Advanced Packaging" - Jeffrey C. Suhling, Auburn University, USA. Join Prof Suhling as he shares fascinating mechanical behaviors of single crystal solder micro bumps used in advanced packaging technologies like SIP and 3D integration and how his team characterize such elastic properties, modeling crystallographic deformation mechanisms, and develop machine learning models for predicting such behaviors
- "New Innovation of Heterogeneous Integration in AI and ML Era" - Jin Yang, Samsung, Join Dr Yang as he unravels innovation in heterogeneous integration.
- "Forward-Looking Roadmap View to Enable Heterogeneous Integration in the next 10 years" - Gamal Refai-Ahmed, AMD, USA. Join the quest for technological unity as we dissect the complexities and prospects of heterogeneous integration. What does the future hold? Let's visualize it together.
- "Development of Novel Polymer Materials for Advanced Packaging" - Takenori Fujiwara, Toray, Japan. Experience a paradigm shift in packaging materials, where science meets innovation. Witness first-hand the unveiling of pioneering polymer compositions set to redefine modern electronics.
- "Fluxless Bonding for Higher Density & Bandwidth Packaging" - Steve Ng, KnS. Explore the intricacies of fluxless bonding with Steve Ng, revolutionizing the realms of density and bandwidth in packaging. This is where possibility meets reality.
- "Wafer to Wafer and Die to Wafer Hybrid Bonding for Advanced Interconnects" - V. Dragoi, EVG, Austria. Prepare for a deep dive into the microscopic world of wafer-to-wafer and die-to-wafer connections. Discover how precision, efficiency, and innovation can create bridges within the silicon jungle.
- "Die-to-Wafer Hybrid bonding to address next-gen Electronics Packaging Challenges" - Avi Shantaram, Applied Materials, USA. Future-proofing technology begins today. Embark on an intellectual expedition and see how hybrid bonding stands as the vanguard in next-gen electronics packaging.
- "Signal and Power Integrity of CoWoS-R in Chiplet Integration Applications" - Chuei-Tang Wang, TSMC, Taiwan. A session dedicated to unraveling the performance enigma of CoWoS-R in the realm of chiplet applications. When theory meets practice, a new understanding emerges.
- "The Era of Generative AI and Advanced Packaging" - Chak Wing Kei, Tommy, ASMPT, Hong Kong. Traverse the intersection where artificial intelligence and advanced packaging coalesce, heralding an era of generative designs and transformative applications.
- "AI and Failure Mechanics based Life prediction for electronic systems" - Pradeep Lall, Auburn University, USA. Glimpse into a future where system failures transition from reactive quick fixes to proactive maintenance, guided by the merger of AI and failure mechanics.
- "Fan-out wafer level packaging solutions for mmWave applications" - Tanja Braun, Fraunhofer IZM, Germany. Tanja Braun decodes the future of high-speed, high-frequency applications with state-of-the-art fan-out wafer-level packaging solutions.
- "3D Integrated Package for High Performance Computing Application" – Yu-Po Wang, SPIL, Taiwan. The demand of memory size and computing power to process gigantic parameters is beyond imagination. See how packaging integration has evolved from 2.5 into advanced 3D integration by bringing components closer vertically to make this happen.
EPTC 2023 isn’t just a conference; it’s a launchpad for the next technological revolution. Each discourse is a mosaic piece, contributing to the grand design of tomorrow’s technological landscape. We’re not just discussing the future; we’re crafting it with our ideas, discussions, and visions.
Reserve your opportunity to be among the architects of technological evolution. Participate, engage, question, and connect at the heart of where the future takes shape.
Secure your attendance now. The future is calling, and it begins at EPTC 2023.
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