Chiplets as enabler for system scaling

Date: December 7, 2022 (Wednesday), 4:0-5:30 PM

Venue: Waterfront Ball Room

Abstract:

Chiplets (or dielets) are gaining traction in the industry as key enabler for future system performance scaling and functional diversification. Unlike monolithic SoC, this technology allows one to mix and match disparate dielets and assemble them using innovative interconnect schemes. It leads to flexible IP reuse, higher yield, shorter time to market and modularity with performance that matches that of SoC. This panel revisits the drivers behind chiplets technology, the manufacturing ecosystem, and use-cases.  The Universal Chiplet Interconnect Express (UCIe) will also be discussed. This panel ends with a critical examination on the supply chain and market outlook.

Moderator: 

Prof. Chuan Seng Tan 

Panelists:

Dr. Ravi Mahajan (Intel),

Dr. Dielacher Bernd (EVG),

Dr. Raj Pendse (Meta),

Dr. Yik Yee Tan (Yole Intelligence)