Panel Session
Panel Sesson 1: Chiplets Integration
Date: December 5, 2023(Wednesday), 11:00 AM -12:30 PM
Venue: Grand Ballroom Foyer
Moderator: Dr Zheng Jiantao (Huawei)
Panelists:
·
Dr.
Ravi Mahajan, Intel Fellow and Director of Pathfinding for Assembly and
Packaging Technologies, Intel;
·
Dr. Chih.Pin.Hung, Vice President,
Corporate R&D, ASE;
·
Dr.
Arvind Sundarrajan, Managing Director/ Head of Applied Packaging Development
Center, Applied Materials;
·
Dr.
Surya Bhattacharya, Director of System in Packaging, Institute of Microelectronics,
A*STAR Singapore.
Panel Sesson 2: Artificial Intelligence for Package Design and Manufacturing
Date: December 5, 2023(Wednesday), 3:30PM -5:00 PM
Venue: Grand Ballroom Foyer
Moderator: Dr. Sam Karikalan (Broadcom Inc), Vice President of Conferences - IEEE EPS
Panelists:
·
Ms.
Grace O'Malley, Vice President Technical and Project Operations, iNEMI;
·
Mr.
Vincent DiCaprio Vice President, Applied Materials;
·
Mr.
Samuel Goh, Senior Director, Kulicke & Soffa;
·
Prof.
Kuo Ning Chiang, National Tsing Hua University.
For full details of the panel session, click here to download PDF.