Panel Session


Panel 1: Supply Chain Ecosystem Challenges Impacting Global Electronic Packaging


This Panel will cover supply chain trends (e.g. convergence, mergers, and acquisitions), material shortages, equipment limitations, manufacturing capacity, and disruptions (e.g., geopolitical, natural & human resources, regulatory & Environmental Health and Safety).  Each of these factors must be taken into consideration when making technical and business decisions. Exacerbating these challenges is the COVID pandemic.

The Panel is chaired by Dr Kitty Pearsall and panelists are C. P. Hung, ASE;  Fan Chun Ho, Nelson, ASM PT; Jan Vardenman, TechSearch International


Panel 2: Can companies benefit from Artificial Intelligence in smart manufacturing environment?

 

Manufacturing companies currently view AI as a new tool that is either early in the implementation phase or still an R&D tool for advanced analytics. Different companies have adopted different approaches to AI while Smart manufacturing is fully underway in terms of getting information from their equipment and sending it to the cloud. AI has many benefits of being implemented across both in front end and back-end semi. The panel will be discussing topics on how each company is approaching AI differently at different stages of implementation and exploiting AI potential. The macro question will be with a large amount of investments to equipped with AI-ready and continuous effort of R&D into AI / ML, do companies see monetary benefits in this early stages or will this pan out to a longer-term strategy.  The objective of this panel session is to share strategies and best practices with Smart manufacturing professionals on how AI methods can harvest solutions in the early stages and how different companies are dealing with the challenges.

The panel is chaired by Chan Pin CHONG, Executive Vice President & General Manager, Products & Solutions, Kulicke & Soffa, Singapore. Panelists are Ranjan Chatterjee, Executive Vice President, Smart Factory Business Solutions at Cimetrix; Tan Chun Sheng, Group VP & General manager at STMicroelectronics;  Daniel Gamota, vice president of the Manufacturing Technology & Innovation Organization at Jabil; Tick Kwang (TK) Loh, Senior Director, Operations Engineering at Kulicke & Soffa, Singapore




Panel 1 Speakers Biography

  

Dr. Kitty Pearsall (AM’84-M’01-SM’02) received the BS degree in Metallurgical Engineering (1971) from the UT El Paso. Kitty received the MS and Ph.D. degree in Mechanical Engineering and Materials from the UT Austin in 1979 and 1983 respectively. Kitty worked for IBM from 1972 to 2013. In 2005 Kitty was appointed an IBM Distinguished Engineer and was elected to the IBM Academy of Technology.  Kitty received 4 IBM Outstanding Technical Achievement Awards; holds 9 US patents; 2 patents pending; and 8 published disclosures. She has numerous internal publications as well as 22 external publications in her field. Kitty was awarded the Women in Technology Fran E. Allan Mentoring Award (2006) in recognition of her people development both in and outside of IBM. Currently Kitty is President of Boss Precision Inc. and works as an Independent consultant. This has included a one year engagement with Shainin Corporation. Kitty is an active member in IEEE and CPMT. She is a member of TMS, American Society of Metals, and WIE. Kitty has more than 22 years’ experience with ECTC serving as a member of the ECTC Manufacturing Technology Committee (1993-2013) and as the Professional Development Course Chair since 2006. During Kitty's 10 years on the CPMT Board of Governors she has served in many roles: Member at Large, Strategic Awards Director, VP of Education and currently Director of Chapter Programs. In each role Kitty made key contributions.

 

Dr. CP Hung currently holds the position of Vice President, Corporate R&D, at ASE Group. Based in Kaohsiung, Taiwan, he leads teams responsible for next-generation product development featuring integrated technologies, as well as a broad range of advanced chip, package, and system integration solutions.During his tenure, Dr. Hung has performed a variety of management roles at ASE, including VP of Corporate Design, VP of Central Engineering & Business Development and VP of Logistic Services Integration. He holds 167 patents encompassing IC packaging structure, process, substrate, and characterization technology. He has also published over 62 conference and journal papers. Dr. Hung has been the SEMICON Taiwan PKG & TEST Committee Chair since 2013, IEEE EPS Board of Governor since 2019.



Fan Chun Ho, Nelson is the Vice President, APT Business Development, Semiconductor Solution Experience.  He has more than 30 years of experience in the Semiconductor Packaging industry. Prior to joining ASM Pacific Technology, Nelson was a Co-Founder of a specialized thermal cooling solution company.  Previously, he held multiple senior management roles in R&D and Manufacturing in ASAT, an OSAT in Hong Kong. Nelson holds more than 40 US patents in semiconductor packaging technologies. Education received his BSc in Electrical Engineering from the University of Colorado at Colorado Springs, USA.



E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow.  She is a member of MEPTEC, SMTA, and SEMI.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.  



Panel 2 Speakers Biography


 

Chan Pin Chong was appointed as Executive Vice President & General Manager, K&S' Products and Solutions in December, 2019. He joined K&S in 2014 as Vice President of Wedge Bonders business unit and has successfully turnaround the business and led the team to higher growth by diversifying the business into the battery bonding market. Chan Pin is a technology industry veteran with more than 24 years of engineering and operations experience in the semiconductor and electronics industry. He started his career first as a Process and Test Engineer at Motorola Pagers and Cellular group and pioneered multiple factories in Asia before advancing to the role of Manufacturing Manager at Flextronics. In 1999, Chan Pin joined KLA-Tencor and held a number of diverse positions, including Senior Technical Director of Engineering and General Manager of Strategic Business Unit in Greater China. Chan Pin then pioneered the efforts of starting the MEMS factory in Singapore when he became the Vice President of Sales and General Manager at Form Factor. Most recently, he was the Global President & CEO at Everett Charles Technologies, managing and leading in test and probe technologies. Chan Pin received his bachelor's degree in Electrical Engineering and Computer Science from the State University of New York at Buffalo and a master's degree in Business Administration from the University of Leicester, United Kingdom.



Ranjan Chatterjee, is Executive Vice President of Cimetrix where he oversees all aspects of business strategy and execution for the Smart Factory business. His focus is on extending and introducing cloud and cognitive software into Industry 4.0 and Industrial Internet of Things (IIoT) initiatives by interfacing manufacturing equipment with big data and embedded analytics tools. With nearly three decades of experience across the cloud, mobility, networking, security and cognitive markets. Ranjan joined Cimetrix from Motorola. At Motorola, Ranjan was General Manager of the Software Solutions group that pioneered disruptive, game-changing software technologies that dominated the market in mobile platforms, cloud networking and cloud services solutions. Ranjan has held positions of increasing responsibility at Motorola in various divisions including Semiconductors, Mobile phone, Automotive and Public Safety and brings significant experience in strategic planning and execution, organization development, and incubating and scaling new businesses. Ranjan led the development and deployment of a standards-based factory control systems for Semiconductor, SMT and assembly factories, which encompassed multiple factories around the world, and connected thousands of pieces of equipment. Mr. Chatterjee currently sits on the Board of iNEMI. Ranjan has a M.S. in Computer Science from Carnegie Mellon University.



Tan Chun Sheng  is Group VP & General manager for STMicroelectronics Muar , Malaysia. CS Tan  graduated from USM in 1991 with a 1st Class Honors degree in Applied Physics and a winner of the Faculty Gold Medal. He also holds an MBA from USM. CS started his career in National Semiconductor Penang and has an illustrious career spanning over 30 years covering industries such as Semiconductor, Hard Disk Storage, and Electronics Manufacturing Services. In the past 15 years, CS has been the General Manager of large MNC factories, such as Flextronics, ON Semiconductor, and ST Microelectronics where he is currently based in. Throughout his career, CS Tan has led various important manufacturing initiatives such as Lean Manufacturing, Total Quality Management, Reliability, Centered Maintenance and more recently Industry 4.0 (Connected Manufacturing). CS Tan has spoken in various industry seminars and workshops in diverse fields such as Supply Chain Management, Factory Security, and Smart Manufacturing. He was also recently appointed as Adjunct Professor to the Faculty of Electrical and Electronics Engineering in UTEM, Melaka. 



Daniel Gamota is vice president of the Manufacturing Technology & Innovation Organization at Jabil. He is leading several international sites that are developing and deploying technologies & innovations for the manufacturing of medical, industrial, energy, consumer, aerospace, automotive, and defense products.  Dan is also responsible for the enterprise technology R&D investment strategy that leverages novel tools and processes to investigate megatrends, determine customer needs, and prioritize technology R&D investments. Prior to joining Jabil, Dan was director and fellow of the technical staff at Motorola. He was elevated to IEEE Fellow and was named a Dan Noble Fellow at Motorola (top 0.1% of engineers) for his contributions and leadership in the fields of manufacturing, microelectronics, nanotechnologies, and printed & flexible electronics. He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council.  Dan earned a Ph.D. in Engineering from the University of Michigan and an M.B.A. from the Kellogg School of Management, Northwestern University.