Panel Sesson 1: Chiplets Integration

Date: December 5, 2023(Wednesday), 11:00 AM -12:30 PM

Venue: Grand Ballroom Foyer

Moderator: Dr Zheng Jiantao (Huawei)

Panelists:

·        Dr. Ravi Mahajan, Intel Fellow and Director of Pathfinding for Assembly and Packaging Technologies, Intel;

·        Dr. Chih.Pin.Hung, Vice President, Corporate R&D, ASE;

·        Dr. Arvind Sundarrajan, Managing Director/ Head of Applied Packaging Development Center, Applied Materials;

·        Dr. Surya Bhattacharya, Director of System in Packaging, Institute of Microelectronics, A*STAR Singapore.

Panel Sesson 2: Artificial Intelligence for Package Design and Manufacturing

Date: December 5, 2023(Wednesday), 3:30PM -5:00 PM

Venue: Grand Ballroom Foyer

Moderator: Dr. Sam Karikalan (Broadcom Inc), Vice President of Conferences - IEEE EPS

Panelists:

·        Ms. Grace O'Malley, Vice President Technical and Project Operations, iNEMI;

·        Mr. Vincent DiCaprio Vice President, Applied Materials;

·        Mr. Samuel Goh, Senior Director, Kulicke & Soffa;

·        Prof. Kuo Ning Chiang, National Tsing Hua University.

 For full details of the panel session, click here to download PDF.