Panel Session: Packaging challenges & opportunities for 5G applications
Time : 4:15-6:15pm, December 4, 2019
Venue : Main Hall
The move to 5G is driving changes and developments in key areas such as materials, design, and testing. This session features a panel of industry leaders who will identify and discuss the key challenges from their perspectives of the supply chain; the presentations will be followed by an in-depth Q&A session with the audience. Speakers include technical experts from: Samsung, Hitachi Chemical, Nanyang Technological University, Fujitsui Advanced Technologies, TTM Technologies and Micron.
Dr. Haley Fu
Director, Project Management & APAC Operations, iNEMI (International Electronics Manufacturing Initiative)
Haley Fu is now the Director for project management and Asia Pacific operations
of iNEMI. In recent years, she has led consortia programs on low temperature
soldering, copper wire bonding, ultra-low loss laminate/PCB, corrosion test
development, package warpage characterization, panel level package flowability
and warpage, etc. Prior to iNEMI, Haley
worked for Motorola, UTStarcom and Schneider Electric with various R&D and
supply chain management positions. Haley received her PhD in mechanical
engineering from Shanghai Jiao Tong University in 2000
Dr. Seung Wook Yoon
Corporate VP / Package Technology Planning, Test & System Package, Samsung Electronics
Dr. YOON is currently working as Corporate VP/Head of Team of Package Technology Planning, Test & System Package, Samsung Electronics. Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Currently working as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.
Technical Director of Packaging Solution Center, Hitachi Chemical Co., Ltd.
He graduated from the University of Tokyo in 1986 and received Ph.D degree in 1995 from Nagoya University. He has been working in the research of electronic materials more than 30 years. Since he joined Hitachi Chemical in 2015, he has been a technical director of Packaging Solution Center. Current his research topic is process and material development of advance package regarding FO-WLP/PLP, 2.5D, 3D and so on. And he is also leading “JOINT” (Jisso Open Innovation of the Top) consortium which has been founded by Hitachi Chemical in 2018.
Prof. Yue Ping Zhang
Professor, School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore
Y. P. ZHANG is a full Professor with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE APS), a Member of the IEEE APS Paper Award Committee. Prof ZHANG was a Member of the IEEE APS Field Award Committee (2015-2017), an Associate Editor of the IEEE Transactions on Antennas and Propagation (2010-2016), and the Chair of the IEEE Singapore MTT/AP joint Chapter (2012), leading the Chapter to win the Best Chapter Awards from the IEEE APS and the IEEE Singapore Section (2013), respectively. Prof ZHANG has published and accepted numerous papers. He received the prestigious IEEE APS Sergei A. Schelkunoff Prize Paper Award (2012). He holds 7 US patents. Prof Zhang was awarded a William Mong Visiting Fellowship by the University of Hong Kong (2005). He was selected by the Recruitment Program of Global Experts of China as a Distinguished Scholar affiliated to Shanghai Jiao Tong University (2012). He has been elevated to the grade of IEEE Fellow for contributions to integrated antennas and subsurface radio since 1 January 2010.
Mr. Shunichi Kikuchi
Corporate Vice President, Fujitsu Advanced Technologies Limited
Kikuchi joined Fujitsu in 1981. He was engaged in developing liquid cooling
modules and multi-chip modules for mainframe servers and supercomputers for 18
years. After that, he was specialized in high density system packaging for
notebook PCs and mobile phones for 8 years. Then he has again been in charge of
system packaging for high-end servers and supercomputers for 12 years. He has
authored and coauthored more than 30 papers and more than 20 U.S. patents. His
recent interests are the development of system packaging for high-speed signal
integrity and the digital transformation of the system packaging technologies.
Mr. Kikuchi joined Fujitsu in 1981. He was engaged in developing liquid cooling modules and multi-chip modules for mainframe servers and supercomputers for 18 years. After that, he was specialized in high density system packaging for notebook PCs and mobile phones for 8 years. Then he has again been in charge of system packaging for high-end servers and supercomputers for 12 years. He has authored and coauthored more than 30 papers and more than 20 U.S. patents. His recent interests are the development of system packaging for high-speed signal integrity and the digital transformation of the system packaging technologies.
Sr. Manager, Advanced Development, TTM Technologies
Mr. Erkko Helminen (M.Sc., EE) is Advanced Development Senior Manager in Advanced Development, Corporate Technology at TTM Technologies, Inc. His key responsibilities are Advanced Development project management, customer projects, process development, SI engineering, and material engineering. He received his diploma M.Sc. from Lappeenranta Univ. of Technology majoring in industrial electronics. He has hold several engineering and development management positions in Aspocomp, Meadville, and TTM. His interests in PCB area are future fabrication processes, smart manufacturing, PCB materials, high speed, and RF PCB technologies, and advanced interconnection technologies.
Dr. Gokul Kumar
Sr. Manager, Packaging Design and Development, Micron
Dr. Gokul Kumar has over ten years of experience in electronic packaging, with multi-disciplinary background encompassing package design, physical design/layout, signal/power integrity, substrate fabrication, Manufacturing, technology validation and product development. He currently serves as a Senior Manager for Design with Micron, USA. In this capacity, he works to push the technology envelope for both Flash and DRAM products with new package design developments. He has co-authored over 15 journal and conference publications, which have been cited over 450 times. He also has 5 United States Patents in the area of memory-logic integration. In addition, Dr. Kumar is a peer reviewer for a number of internationally reputable conferences and journals. He has also served on several technical panel committees, in addition to being the technical invited speaker at the IEEE Electronics Packaging Technology Conference last year. He received his PhD and MS specializing in Electrical and Computer Engineering, from the Georgia Institute of Technology.