Program Overview

Keynote Talks

Title : To be announced

Speaker: Seung Wook Yoon, Corporate VP/Head of Team of Package Technology Strategy and Planning, – Samsung Electronics

 

Title : Future directions for 3D Integration technologies, enabling further electronic system-level scaling benefits

Speaker: Eric Beyne, Senior Fellow, VP R&D, Director 3D System Integration

 

Technology Talks

1. Roadmap based on holistic understanding of thermo-mechanical challenges from package to system to maximize silicon performance

Speaker: Gamal Refai-Ahmed, LFASME, FIEEE, FCAE, FEIC, Xilinx Fellow


2.Packaging materials as a key enabler for future megatrends.

Speaker: Klemens Brunner, President Heraeus Electronics (Geschäftsführer) at Heraeus Materials

 

3.Innovative Copper Electrodeposition Solutions for High Density Fanout (HDFO) Package Technology

Speaker: Bryan Buckalew, Technical Director, Lam Research Corporation, USA


4.Hybrid Bonding - State of the art  and upcoming requirements 

Speaker: Paul Linder, Executive Director, EV Group


Panel Discussion

Theme of the panel topic: The Role of Semiconductor Packaging Supply Chain Ecosystem to Deal the Global Chip Shortage

Chair: Kitty Pearsall, IEEE-EPS, President Elect

Speakers: To be announced



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