Welcome to EPTC 2013
The 15th Electronics Packaging Technology Conference is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.
Besides the technical sessions on 12th and 13th December 2013, I would like to announce that there will be
- Keynotes deliberating on technology trends/advancement by Mr Mike Leary (Vice President of Mixed Signal Design, Xilinx, USA) and Toru Ogawa (Director -Backend Business Division, TSMC).
- An evening forum session on 11th December 2013 chaired by Dr John Lau (ITRI Fellow, Taiwan) titled "Supply chain Integration in 2.5/3D packaging" by experts covering 2.5/3D technology trend, Frontend-Backend integration, Business model & value supply chain and most importantly, OSATs' high volume production readiness.
- Great learning opportunities in short courses and new developments in industry through exhibitors.
We are looking forward to meeting you.
Chong Chin Hui
EPTC 2013 Program Chair