EPTC 2022 PDC
Course #1: Fan-Out Packaging and Chiplet Heterogeneous Integration
John H Lau, Unimicron Technology Corporation
Abstract: Fan-out wafer/panel-level packaging has been getting lots of tractions since TSMC used their integrated fan-out to package the application processor chipset for the iPhone 7. In this lecture, the following topics will be presented and discussed. Emphasis is placed on the fundamentals and latest developments of these areas in the past few years. Their future trends will also be explored. Chiplet is a chip design method and heterogeneous integration (HI) is a chip packaging method. HI uses packaging technology to integrate dissimilar chips, photonic devices, and/or components (either side-by-side, stacked, or both) with different sizes and functions, and from different fabless design houses, foundries, wafer sizes, and feature sizes into a system or subsystem on a common package substrate. These chips can be any kind of devices and don’t have to be chiplets. On the other hand, for chiplets, they have to use the heterogeneous integration to package them. For the next few years, we will see more implementations of a higher level of chiplet designs and HI packaging, whether it is for time-to-market, performance, form factor, power consumption or cost. In this lecture, the introduction, recent advances, and trends in chiplet design and HI packaging will be presented.
Biography: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, has published more than 515 peer-reviewed papers (out of which 375 are the principal investigator), 40 issued and pending US patents (out of which 25 are the principal inventor), and 23 textbooks (all are the first author). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating to industry/academy/society meetings/conferences to learn, to share, and to contribute
Who
Should Attend?
If you
(students, engineers, and managers) are involved with any aspect of the
electronics industry, you should attend this course. It is equally suited for
R&D professionals and scientists. The lectures are based on the
publications by many distinguish authors and the books (by the lecturer) such
as Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration
(Springer, 2019), and Semiconductor Advanced Packaging (Springer, 2021). Each
attendee will receive more than 300 pages of lecture notes.
Course #2: Advanced Packaging for MEMS and Sensors
Horst Theuss, Infineon Technologies
Abstract: Sensors are everywhere! They
create data and provide the “food” for the Internet of Things (IoT). This course provides an overview on package
approaches for MEMS- and sensor devices. Starting from standard semiconductor
packaging, MEMS- and sensor specific challenges will be worked out. Case
studies will make up a large part of the PDC, covering advanced packaging, such
as Fan Out Wafer Level Packaging (FOWLP) but also mature leadframe and substrate-based
concepts.
The
discussion of MEMS packaging accounts for the major part of the course. MEMS
involve mechanically movable or oscillating parts creating the need for cavity
packaging. Various concepts for cavity packages will be discussed followed by
an elaboration on package induced stress and its impact to MEMS performance.
Case studies on pressure sensors and microphones include elaborations on
package induced mechanical stress and its implications on device performance.
This includes a discussion on package materials, their properties and function
in the device. Within a short side trip we will evaluate options to assemble a
MEMS-microphone chip into a FOWLP. Robustness requirements and approaches for
risk mitigation in harsh environments represent a further topic of the PDC’s
MEMS section.
A
further section in the course covers RF-packaging for GHz applications making
use of FOWLP. The discussion will include the capability of FOWLP with respect
to RF-specific layouts but also briefly dig into concepts with antennas
integrated into the package. Magnetic sensors and their implications to
packaging represent the last application-specific section of the PDC.
The
summary is intended to lead into a roadmap discussion about the future of MEMS
and sensor packaging. Will the focus be on SiP (System in Package) or SoC
(System on Chip)? What will be the future requirements before the background of
IoT, heterogeneous integration and advanced packaging activities?
Biography: Horst Theuss received his Ph.D. degree in Physics from the University of
Stuttgart in 1993. His research was awarded a “Otto Hahn Medal for young
scientists” by the Max Planck Society. As a research staff member at the Max
Planck Institute for Metal Research he concentrated on magnetic properties of
superconductors and amorphous materials. Within a one-year assignment at the
IBM Almaden Research Center in San Jose, CA, he worked on magneto-optical
properties of exchange-coupled thin layers. In 1996, he started his industrial
career at Vacuumschmelze GmbH, Hanau/Germany as a product marketing manager for
alloys with special magnetic properties. Horst Theuss joined Infineon
Technologies, Regensburg/Germany in 2000. Since then he has been developing
package concepts and processes in the fields of discrete semiconductors, wafer
level packaging, cavity packaging, materials and integration. As a Senior
Principal he is today responsible for predevelopments with a focus on MEMS and
Sensors. Horst Theuss holds approximately 100 patents. As author and co-editor
he has contributed to numerous scientific papers, conferences and books.
Who
Should Attend?
The course is intended for engineers and students, who would like to broaden their view on MEMS and sensor packaging, but also to dig somewhat deeper into specific topics. It will also be useful for technical managers working in the field, who would like to get a picture on the packaging landscape and the specific needs for sensors and MEMS.
Course #3: Reliability Engineering Testing Methodology and Statistical Knowledge for Qualifications of Consumer and Automotive Electronic Components
Fen Chen , Cruise LLC (a GM company)
Abstract: The consumer electronics
industry and today’s fast-growing automotive industry continue to demand
ever-higher product hardware reliability. This tutorial will provide an
overview of reliability testing methodology and statistical knowledge for
qualifications of consumers and automotive electronic components. The
reliability testing management includes various Rel testing methods and their
application to product development at different phases will be first
introduced. Some important statistic/probabilistic concepts including
uncertainty, confidence level, and how to minimize/deal with them will be
discussed. An effective approach to mitigate low sample size and short test
duration will be introduced. Then the tutorial will focus on the physics of
failure-based acceleration life models for some common reliability testing
failures. A deep dive discussion on the temperature cycling model considering
dT acceleration, dwell time acceleration, ramp rate acceleration, and Tmax
acceleration will be explored. Next, a typical methodology to develop a
PoF-based Rel validation testing plan reference to the product field mission
profile will be introduced. The mission profiles of conventional vehicles and
consumer smartphones will be compared. How to develop a customized mission
profile for an autonomous vehicle specifically per its deployment location will
be described. Finally, some examples of hardware failure modes with their risk
assessments and lifetime modeling will be presented.
Biography: Fen Chen
received his Ph.D. degree in Electrical Engineering in 1998 from the University
of Delaware. From 1997 to 1998, he was with Intel Component Research in Santa
Clara, CA as a graduate intern working on IC interconnect reliability. He
joined IBM microelectronics at Essex Junction, VT in 1998 and had worked on
semiconductor technology reliability issues until 2015. From 2015 to 2019, he
worked for Apple Inc at Cupertino, CA as a senior reliability engineer focusing
on the qualifications of various consumer electronic products. In 2019, he
joined Lumileds in San Jose, CA as the director of quality and reliability and
was responsible for qualifying novel µLED MCM products for automotive
applications. After 6-month of work at Lumileds, he joined GM Cruise in 2019 as
a senior staff reliability/validation engineer and has been working on
validations of electronic, optical, and electromechanical modules for
groundbreaking Cruise AV hardware systems since then. He holds more than
fifty-five patents and has published over 60 technical papers/invited talks in
various journals and conference proceedings.
Who Should Attend?
Engineers and tech managers already involved in
the consumer product and automotive product fields, and those who need a
fundamental understanding or a broad overview of the product reliability
qualification.
Course #4: Photonic Technologies for Communication, Sensing, and Displays
Torsten Wipiejewski, Huawei Technologies
Course Objective:
This
course will provide an overview on the various photonic technologies that
enable optical communication, optical sensing, and modern display applications.
These applications are key for the information and communication technology of
today and path a way to the future. High speed optical communication from board
level in data centers to long haul transmission requires photonic components
with high speed and high reliability. We will discuss the main components such
as laser diodes of various types, high speed optical modulators and
photodetectors as well as integration schemes such as photonic integrated
circuits PICs and packaging aspects. Photonic technologies are also widely used
as sensors for various applications including health monitoring. One key
advantage is the potential for non-invasive measurements that facilitates the
usage by end-users without specific medical knowledge. Packaging should provide
high accuracy solution at low cost. Displays are the main media nowadays for
bringing information to people. They range in size from smart watches to smart
phones, laptops and tablets all the way to large screen TVs and video walls. We
review current technologies and new developments such as quantum dots and micro
LEDs as well as some features of 3D displays. In particular, micro LEDs for
large size displays require novel assembly technologies to mount chips of only
several micro meter in size with extremely high yield at very low cost. The
mass transfer of thousands of chips simultaneously is an option to achieve this
challenging target.
Course Outline:
- Fundamental properties of photonic components
- Light sources (LEDs, laser diodes, others)
- Transmitter and receiver
components in optical communication (lasers, modulators, photodetectors,
passive optical components, photonics integrated circuits PICs, silicon
photonics, optical modules), monolithic and hybrid integration, packaging.
- Optical sensing elements and
applications (spectrometers, light sources, photoacoustic sensors, frequency
combs)
- Display technologies (liquid crystal displays LCD, organic light emitting diode OLED displays, quantum dot emissive layers, micro LED arrays and large size displays using chiplet mass transfer and bonding, 3D displays)
- Summary and outlook
Who
Should Attend: The course addresses engineers, scientists and students who would like to
get a general overview of various photonics technologies used in todays
products and future developments. The aim is to describe which photonic
technologies can be used in various applications and what current limitations
are and which new technologies are being developed for further improvements or
aiming at technology break throughs.
Biography: Dr. Torsten Wipiejewski joined
Huawei Technologies in 2014 and is responsible for the European technology
sourcing of Huawei’s Hardware Engineering Institute. His interest covers all
hardware aspects for products ranging from smart watches to optical
communication systems. He has also been appointed as Technical Advisor to the
President of Huawei’s European Research Institute. Previously, Torsten was an
investor in renewable energy, CEO at Optogan (Germany, Finland) making blue
LEDs, and COO at Firecomms (Ireland) making optical transceivers for automotive
applications. He also held management positions at ASTRI in Hong Kong, Agility
Communications in Santa Barbara, CA, USA as well as Infineon, Osram, and
Siemens in Germany. Torsten received a “summa cum laude” Ph.D. degree in electrical
engineering from the University of Ulm, Germany and has been an executive
member of several international conferences. He was the General Chair of ECTC
2008 and has lectured several courses at conferences and universities. He holds
more than 30 patents and has published over 100 scientific papers and
presentations.
Course #5: Tutorial for Reliability of Heterogeneous Integration (HI) Systems - Reliability Needs of HI Stakeholders
SB Park, The State University of New York(SUNY) at Binghamton
Course Objective:
The
Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of
electronics identifying technology requirements and potential solutions, in a
post-Moore world. The primary objective is to stimulate pre-competitive global
collaboration between industry, academia and government to accelerate progress.
The roadmap offers professionals, industry, academia and research institutes a
comprehensive, strategic forecast of technology over the next 15 years. The HIR
also delivers a 25-year projection for heterogeneous integration of Emerging
Research Devices and Emerging Research Materials with longer
research-and-development timelines. The HIR is sponsored by three IEEE
Societies (Electronics Packaging Society, Electron Devices Society &
Photonics Society) together with SEMI and ASME EPPD.
This
HIR Tutorial will deal with the near-term as well as far-term reliability
challenges and needs faced by the six major application segments identified in
the HIR Roadmap. These include: (i)
Aerospace and Defense; (ii) Automotive; (iii) High Performance Computing and
Data Centers; (iv) Medical, Health and Wearables; (v) Mobile; (Vi) IoT. The session will also present the phased
vision and activities that are being formulated and proposed by the Reliability
Technology Working Group in the HIR Team, as the pan-industry global approach
needed to meet these reliability needs of the relevant stakeholders. This vision will be presented in terms of
goals and milestones for the short-horizon (1-5 years); mid-horizon (5—10 years)
and far-horizon (10-15 years) time-scales.
The purposes for this HIR tutorial are to elicit audience interest,
solicit voluntary participation from the community in the HIR activities &
to stimulate collaboration among HIR stakeholders around the world.
Biographies:
Seungbae
(SB) Park is a Professor of Mechanical engineering of the State
University of New York at Binghamton. He is also the director of Integrated
Electronics Engineering Center (IEEC), a New York State Center for Advanced
Technology (CAT). He holds a Ph.D. from Purdue University. Professor Park is an
expert in Thermo-Mechanics for electronics components and systems integration.
His contributions have been recognized many international awards and citations.
He has contributed in various advanced packaging including 2.5D/3D package
development, MEMS packaging, reliability assessment of assemblies and systems,
and smart electronics manufacturing. He has more than 200 technical
publications and holds 4 US patents. Dr. Park is an ASME Fellow, Chair of IEEE
Electronic Packaging Society Thermal/Mechanical Technical Committee, Chair of
Executive Committee of ASME Electronics and Photonics Packaging Division
(EPPD), Past Chair of ASME K-16 Committee on Heat Transfer in Electronic
Equipment, and served as an associate editor for ASME Journal of Electronic
Packaging. Professor Park has been helping consumer electronics and packaging
companies as a consultant.
"
Attendees of the PDCs will be
offered Continuing Education Units (CEUs) or Professional Development Hours
(PDHs), by filling EPTC
Survey form on the specific link for each unique PDC (Details to be provided at the end of the PDC). These CEUs and PDHs are recognized by employers as a formal measure of
participation and attendance in “noncredit” self-study courses, tutorials,
symposia, and workshops."
Course #1: Fan-Out Packaging and Chiplet Heterogeneous Integration
John H Lau, Unimicron Technology Corporation
Course #2: Advanced Packaging for MEMS and Sensors
Horst Theuss, Infineon Technologies
Course #3: Reliability Engineering Testing Methodology and Statistical Knowledge for Qualifications of Consumer and Automotive Electronic Components
Fen Chen , Cruise LLC (a GM company)
Course #4: Photonic Technologies for Communication, Sensing, and Displays
Torsten Wipiejewski, Huawei Technologies
Course #5: Tutorial for Reliability of Heterogeneous Integration (HI) Systems - Reliability Needs of HI Stakeholders
SB Park, The State University of New York(SUNY) at Binghamton